A novel microstrip-line structure employing a periodically perforated ground metal and its application to highly miniaturized and low-impedance passive components fabricated on GaAs MMIC

✍ Scribed by Young Yun,

• Book ID: 121341121
• Publisher: IEEE
• Year: 2005
• Tongue: English
• Weight: 759 KB
• Volume: 53
• Category: Article
• ISSN: 0018-9480
• DOI: 10.1109/TMTT.2005.848835