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A novel method for fabrication of a hybrid optoelectronic packaging platform utilizing passive-active alignment

✍ Scribed by Datta, M.; Zhaoyang Hu; Dagenais, M.

Book ID: 119800210
Publisher: IEEE
Year: 2003
Tongue: English
Weight: 376 KB
Volume: 15
Category: Article
ISSN: 1041-1135
DOI: 10.1109/lpt.2002.806090

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