✦ LIBER ✦
A novel MD/FE coupled model for numerical investigation of interfacial thermal resistance in MEMS/NEMS packaging
✍ Scribed by Yang, Ping; Liao, Ningbo
- Book ID
- 115480715
- Publisher
- Taylor and Francis Group
- Year
- 2008
- Tongue
- English
- Weight
- 877 KB
- Volume
- 15
- Category
- Article
- ISSN
- 0927-6440
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