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A novel low-temperature solder based on intermetallic-compound phases with superior high-homologous temperature properties

✍ Scribed by Daewoong Suh; Chi-won Hwang; Minoru Ueshima; Jun Sugimoto


Book ID
113791665
Publisher
Elsevier Science
Year
2008
Tongue
English
Weight
321 KB
Volume
62
Category
Article
ISSN
0167-577X

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