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A novel hybrid heat sink using phase change materials for transient thermal management of electronics

✍ Scribed by Krishnan, S.; Garimella, S.V.; Kang, S.S.

Book ID: 120199459
Publisher: IEEE
Year: 2005
Tongue: English
Weight: 659 KB
Volume: 28
Category: Article
ISSN: 1521-3331
DOI: 10.1109/TCAPT.2005.848534

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