## Abstract A very compact electromagnetic bandgap structure is presented for integrated‐circuits applications. This structure, which is one kind of high‐impedance surface with periodic interdigital elements, is adopted to increase the fringe capacitor in order to compress the overall size of the h
A novel compact interembedded AMC structure for integrated circuits and antenna arrays
✍ Scribed by Dunbao Yan; Chao Wang; Qiang Gao; Naichang Yuan
- Book ID
- 102518244
- Publisher
- John Wiley and Sons
- Year
- 2005
- Tongue
- English
- Weight
- 148 KB
- Volume
- 45
- Category
- Article
- ISSN
- 0895-2477
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✦ Synopsis
Abstract
A novel compact interembedded artificial magnetic conductor (IE‐AMC) structure is introduced in this paper. For a desired bandgap frequency, the cell size of this novel IE‐AMC structure is only 30% to 40% of the conventional Sienvenpiper structure with the same substrate used. The IE‐AMC structure is very suitable to microwave integrated circuits and antenna‐arrays applications, especially in wireless‐communication bands (GSM, PCS, and ISM). © 2005 Wiley Periodicals, Inc. Microwave Opt Technol Lett 45: 303–305, 2005; Published online in Wiley InterScience (www.interscience.wiley.com). DOI 10.1002/mop.20803
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