A Novel 3D CuI Metal–Organic Framework with Middle-Size Channels Despite the Sixfold ThSi2 Interpenetrating Topological Structure

✍ Scribed by Cheng-Zhi Xie; Ze-Feng Zhang; Bao-Feng Zhang; Xiao-Qing Wang; Ru-Ji Wang; Guang-Qiu Shen; De-Zhong Shen; Bin Ding

• Publisher: John Wiley and Sons
• Year: 2006
• Tongue: English
• Weight: 150 KB
• Volume: 2006
• Category: Article
• ISSN: 1434-1948
• DOI: 10.1002/ejic.200500877