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A new method of evaluation of the effect of electron beam and developing process on positive polymeric resists

✍ Scribed by Z. Pelzbauer; R. Wagner

Publisher
John Wiley and Sons
Year
1984
Tongue
English
Weight
371 KB
Volume
29
Category
Article
ISSN
0021-8995

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✦ Synopsis

Synopsis

.A new method of evaluation of the effect of electron beam on the latent changes in degrading polymer resists has been developed on the base of measurement of the developing curve under an interference microscope. An evaluation procedure using the unit parameters (film thickness and development time) has been suggested for the characterization of the sensitivity and contrast of resists.

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The lithographic effect of electron beam in line exposures in scanning electron micruicopy (SEM) on poly(methy1 methacrylate) (PMMA) was evaluated using the line width in a film deposited on a silicium substrate and from the line profiles in a PMMA plate. It was found that the effect of the dose on