A new inspection method applying to CMOS image sensor bumping
✍ Scribed by Der-Chin Chen; Chan-Chun Lin
- Publisher
- John Wiley and Sons
- Year
- 2007
- Tongue
- English
- Weight
- 257 KB
- Volume
- 49
- Category
- Article
- ISSN
- 0895-2477
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✦ Synopsis
Abstract
This article demonstrates a new optical technique, which we apply to the collimating system to measure the parallel degree of CMOS (Complementary Metal‐Oxide Semiconductor) image sensor bumping. We research and develop the new adjustable auto‐collimating system to simplify the testing of CMOS board alignment and to increase the image quality of the cell phone camera. This method is a non‐contact method for testing and can detect the parallel degree deviation to an accuracy of 0.5°. © 2007 Wiley Periodicals, Inc. Microwave Opt Technol Lett 49: 2283–2285, 2007; Published online in Wiley InterScience (www.interscience.wiley.com). DOI 10.1002/mop.22717