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A multichip package for high-speed logic die : Edward G. Myszka, Allison Casey Dixon and Jim Trent. IEEE Transactions on Components, Hybrids and Manufacturing Technology, 16(1), 67 (February 1993)


Publisher
Elsevier Science
Year
1994
Tongue
English
Weight
106 KB
Volume
34
Category
Article
ISSN
0026-2714

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