✦ LIBER ✦
A Model of BGA Thermal Vias as an Example of Lumped Parameter Analysis in Thermal Modeling of SiPs and Stacked Die Packages
✍ Scribed by Colombo, L.; Paleari, D.; Petrushin, A.
- Book ID
- 114564956
- Publisher
- IEEE
- Year
- 2009
- Tongue
- English
- Weight
- 758 KB
- Volume
- 97
- Category
- Article
- ISSN
- 0018-9219
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