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A model for the topography of diamond grinding wheels

โœ Scribed by Philip Koshy; V.K. Jain; G.K. Lal

Publisher
Elsevier Science
Year
1993
Tongue
English
Weight
689 KB
Volume
169
Category
Article
ISSN
0043-1648

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A process model of wafer thinning by dia
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โœ Chao-Chang A. Chen; Li-Sheng Hsu ๐Ÿ“‚ Article ๐Ÿ“… 2008 ๐Ÿ› Elsevier Science ๐ŸŒ English โš– 942 KB

This paper is to develop and investigate a wafer thinning process model (WTPM) to integrate the wafer thickness into set-up parameters and predict total thickness variation (TTV) of ground wafers with modification of the wafer grinding process model (WGPM) developed previously. Due to the variation