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A microstructural study of dislocation substructures formed in metal foil substrates during ultrasonic wire bonding

✍ Scribed by Nikhil Murdeshwar; James E. Krzanowski


Book ID
107447295
Publisher
The Minerals, Metals & Materials Society
Year
1997
Tongue
English
Weight
734 KB
Volume
28
Category
Article
ISSN
1073-5623

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