A microslip model of the bonding process in ultrasonic wire bonders part II: steady teady state response

✍ Scribed by C. M. Hu; N. Guo; H. Du; X. M. Jian

• Book ID: 105851199
• Publisher: Springer
• Year: 2005
• Tongue: English
• Weight: 352 KB
• Volume: 29
• Category: Article
• ISSN: 0268-3768
• DOI: 10.1007/s00170-005-0006-0