A micromachining technology for integrating low-loss GHz RF passives on non-high-resistivity low-cost silicon MCM substrate

✍ Scribed by Zhengzheng Wu; Xinxin Li

• Publisher: Elsevier Science
• Year: 2010
• Tongue: English
• Weight: 734 KB
• Volume: 87
• Category: Article
• ISSN: 0167-9317
• DOI: 10.1016/j.mee.2010.02.011