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A microindentation technique for determining strength of solder interface with silver metallization on Co-fired multilayer ceramic substrate

✍ Scribed by Jian Ku Shang; Rong-Fong Huang; David L. Wilcox


Book ID
107452603
Publisher
Springer US
Year
2001
Tongue
English
Weight
921 KB
Volume
30
Category
Article
ISSN
0361-5235

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