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A method to determine the sweep resistance of wire bonds for microelectronic packaging

✍ Scribed by Huang-Kuang Kung; Yun-Ping Sun; Jeng-Nan Lee; Hung-Shyong Chen

Publisher
Elsevier Science
Year
2008
Tongue
English
Weight
507 KB
Volume
85
Category
Article
ISSN
0167-9317

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