A method of studying thermocompression bonding damage in GaAs using the SEM : B. L. Weiss. Microelectronics7, 35 (1975)

• Publisher: Elsevier Science
• Year: 1976
• Tongue: English
• Weight: 143 KB
• Volume: 15
• Category: Article
• ISSN: 0026-2714
• DOI: 10.1016/0026-2714(76)90010-x