A method for preparing and bonding ultrasonic transducers used in high frequency digital delay lines

✍ Scribed by Sittig, E.K.; Cook, H.D.

• Book ID: 118047669
• Publisher: IEEE
• Year: 1968
• Tongue: English
• Weight: 260 KB
• Volume: 56
• Category: Article
• ISSN: 0018-9219
• DOI: 10.1109/proc.1968.6597