𝔖 Bobbio Scriptorium
✦   LIBER   ✦

A method for extracting high-molecular-weight deoxyribonucleic acid from fungi

✍ Scribed by Charles A. Specht; Concetta C. DiRusso; Charles P. Novotny; Robert C. Ullrich


Publisher
Elsevier Science
Year
1982
Tongue
English
Weight
847 KB
Volume
119
Category
Article
ISSN
0003-2697

No coin nor oath required. For personal study only.

✦ Synopsis


A new method for isolating high-molecular-weight DNA from mycelium of the basidiomycete Schizophyllum commune is reported. Lyophilized mycelium is broken with mortar and pestle, and DNA extracted during gentle shaking in buffer containing 2% sodium dodecyl sulfate and toluene. DNA with double-strand length in excess of 80 kilobase pairs and singlestrand length of 36 kilobases can be prepared routinely in milligram quantities. This DNA is of high purity and suitable for reassociations and recombinant DNA studies. The procedure has also been used to prepare DNA from another filamentous basidiomycete, Heterobasidion annosum, and from yeast. With slight modification the procedure is attractive for isolating recombinant plasmids from yeast.


πŸ“œ SIMILAR VOLUMES


High-Molecular-Weight Polyketones from H
✍ David PΓ©rez-Foullerat; Uwe W. Meier; Sabine Hild; Bernhard Rieger πŸ“‚ Article πŸ“… 2004 πŸ› John Wiley and Sons 🌐 English βš– 287 KB

## Abstract **Summary:** A method to optimize the polymerization conditions in order to favor chain propagation is described for the synthesis of polymers containing low reactive, long, linear 1‐olefins and carbon monoxide (CO). It consists of the use of the olefin monomer as the polymerization sol

Comparison of periprosthetic tissue dige
✍ Ryan M. Baxter; Marla J. Steinbeck; Joanne L. Tipper; Javad Parvizi; Michele Mar πŸ“‚ Article πŸ“… 2009 πŸ› John Wiley and Sons 🌐 English βš– 501 KB

## Abstract There is considerable interest in characterization of wear debris from polyethylene (UHMWPE) bearing components used in total joint replacement. To isolate UHMWPE wear debris, tissue samples must be excised from regions adjacent to revised UHMWPE implant components, followed by exposure