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A method for analysis and profiling of boron, carbon and oxygen impurities in semiconductor wafers by recoil atoms in heavy ion beams

✍ Scribed by M. Petrascu; I. Berceanu; I. Brancus; A. Buta; M. Duma; C. Grama; I. Lazar; I. Mihai; M. Petrovici; V. Simion; M. Mihaila; I. Ghita


Book ID
113276718
Publisher
Elsevier Science
Year
1984
Tongue
English
Weight
296 KB
Volume
4
Category
Article
ISSN
0168-583X

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