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A meshless collocation method for the coupled analysis of functionally graded piezo-thermo-elastic shells and plates under thermal loads

✍ Scribed by Chih-Ping Wu; Kuan-Hao Chiu; Ruei-Yong Jiang


Book ID
113644693
Publisher
Elsevier Science
Year
2012
Tongue
English
Weight
631 KB
Volume
56
Category
Article
ISSN
0020-7225

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