✦ LIBER ✦
A low thermal budget self-aligned Ti silicide technology using germanium implantation for thin-film SOI MOSFET's
✍ Scribed by Ping Liu; Hsiao, T.C.; Woo, J.C.S.
- Book ID
- 114537295
- Publisher
- IEEE
- Year
- 1998
- Tongue
- English
- Weight
- 190 KB
- Volume
- 45
- Category
- Article
- ISSN
- 0018-9383
No coin nor oath required. For personal study only.