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A hybrid topology optimization methodology combining simulated annealing and SIMP

โœ Scribed by N.P. Garcia-Lopez; M. Sanchez-Silva; A.L. Medaglia; A. Chateauneuf


Book ID
108104660
Publisher
Elsevier Science
Year
2011
Tongue
English
Weight
891 KB
Volume
89
Category
Article
ISSN
0045-7949

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A hybrid model composing of 2D axisymmetric quasic-static finite element method, backpropagation network, and direct complex searching optimization for chemical mechanical polishing process (CMP) was established to investigate the optimal parameter sets under the minimum nonuniformity (NU) on wafer