A hot season for MCMs
β Scribed by Jo Ann McDonald
- Publisher
- Elsevier Science
- Year
- 1996
- Tongue
- English
- Weight
- 383 KB
- Volume
- 27
- Category
- Article
- ISSN
- 0026-2692
No coin nor oath required. For personal study only.
β¦ Synopsis
After years of giving the novel idea of multichip module (MCM) packaging a cold reception, the system design community has begun warming to the idea of using MCMs in their next generation designs. The thaw occurred in the spring of 1995 when MCM developers came to grips with common problems that were stalling the market, most of which were not particularly technical in nature. Over the summer, the MCM community seems to have worked through its "political" difficulaes and, as a result, we're likely to see an especially hot season for MCMs in 1995--96.
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