✦ LIBER ✦
A highly robust process integration with scaled ONO interpoly dielectrics for embedded nonvolatile memory applications
✍ Scribed by Shum, D.P.; Hsing-Huang Tseng; Paulson, W.M.; Ko-Min Chang; Tobin, P.J.
- Book ID
- 114536123
- Publisher
- IEEE
- Year
- 1995
- Tongue
- English
- Weight
- 209 KB
- Volume
- 42
- Category
- Article
- ISSN
- 0018-9383
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