✦ LIBER ✦
A Hermetic Seal Using Composite Thin-Film In/Sn Solder as an Intermediate Layer and Its Interdiffusion Reaction with Cu
✍ Scribed by Li-ling Yan; Cheng-kuo Lee; Da-quan Yu; Ai-bin Yu; Won-Kyoung Choi; John-H Lau; Seung-Uk Yoon
- Book ID
- 107455287
- Publisher
- Springer US
- Year
- 2008
- Tongue
- English
- Weight
- 578 KB
- Volume
- 38
- Category
- Article
- ISSN
- 0361-5235
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