✦ LIBER ✦
A full-wafer fabrication process for glass microfluidic chips with integrated electroplated electrodes by direct bonding of dry film resist
✍ Scribed by Vulto, Paul; Huesgen, Till; Albrecht, Björn; Urban, G A
- Book ID
- 111871452
- Publisher
- Institute of Physics
- Year
- 2009
- Tongue
- English
- Weight
- 514 KB
- Volume
- 19
- Category
- Article
- ISSN
- 0960-1317
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