✦ LIBER ✦
A finite-element analysis of intragranular microcracks in metal interconnects due to surface diffusion induced by stress migration
✍ Scribed by He, Dingni; Huang, Peizhen
- Book ID
- 122113738
- Publisher
- Elsevier Science
- Year
- 2014
- Tongue
- English
- Weight
- 812 KB
- Volume
- 87
- Category
- Article
- ISSN
- 0927-0256
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