A Dual-Phase-Lag Diffusion Model for Predicting Intermetallic Compound Layer Growth in Solder Joints

✍ Scribed by Chen, J. K.; Beraun, J. E.; Tzou, D. Y.

• Book ID: 120553278
• Publisher: The American Society of Mechanical Engineers
• Year: 2000
• Tongue: English
• Weight: 113 KB
• Volume: 123
• Category: Article
• ISSN: 1043-7398
• DOI: 10.1115/1.1326438