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A dual mortar approach for 3D finite deformation contact with consistent linearization

✍ Scribed by Alexander Popp; Markus Gitterle; Michael W. Gee; Wolfgang A. Wall


Book ID
102962426
Publisher
John Wiley and Sons
Year
2010
Tongue
English
Weight
924 KB
Volume
83
Category
Article
ISSN
0029-5981

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## Abstract A dual boundary integral equation (BIE) formulation is presented for the analysis of general 3‐D electrostatic problems, especially those involving thin structures. This dual BIE formulation uses a linear combination of the conventional BIE and hypersingular BIE on the entire boundary o