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A comparative study of diffusion induced grain boundary migration, recrystallization and volume diffusion during the low temperature diffusion of Al into Cu and Au

✍ Scribed by F.J.A. Den Broeder; M. Klerk; J.M. Vandenberg; R.A. Hamm


Publisher
Elsevier Science
Year
1983
Weight
811 KB
Volume
31
Category
Article
ISSN
0001-6160

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