✦ LIBER ✦
A case study on the impact of local material chemistry on the mechanical reliability of packaged integrated circuits: Correlation of the packaging fallout to the chemistry of passivation dielectrics
✍ Scribed by Chukwudi A. Okoro; Yaw S. Obeng
- Book ID
- 113937608
- Publisher
- Elsevier Science
- Year
- 2012
- Tongue
- English
- Weight
- 424 KB
- Volume
- 520
- Category
- Article
- ISSN
- 0040-6090
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