A dual BIE approach for large-scale mode
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Y. J. Liu; L. Shen
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Article
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2007
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John Wiley and Sons
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English
โ 564 KB
## Abstract A dual boundary integral equation (BIE) formulation is presented for the analysis of general 3โD electrostatic problems, especially those involving thin structures. This dual BIE formulation uses a linear combination of the conventional BIE and hypersingular BIE on the entire boundary o