A blind separation method of overlapped multi-components based on time varying AR model

Milling and separation of the multi-comp

Milling and separation of the multi-component printed circuit board materials and the analysis of elutriation based on a single particle model

✍ R. Vetri Murugan; S. Bharat; Abhijit P. Deshpande; Susy Varughese; Prathap Harid 📂 Article 📅 2008 🏛 Elsevier Science 🌐 English ⚖ 905 KB

Electronic waste, in the form of printed circuit boards (PCBs) or printed wiring boards (PWBs), represents a significant and growing fraction of the waste generated in many communities. It is necessary to identify schemes to manage and dispose this waste in an environmentally safe manner. The presen