𝔖 Bobbio Scriptorium
✦   LIBER   ✦

A 3D thermal model for electrostatic discharge thermal runaway in semiconductor devices

✍ Scribed by H.H. Choi; T.A. DeMassa


Publisher
Elsevier Science
Year
1995
Tongue
English
Weight
279 KB
Volume
38
Category
Article
ISSN
0038-1101

No coin nor oath required. For personal study only.


πŸ“œ SIMILAR VOLUMES


On a Petrov–Galerkin method for the elec
✍ John J.H. Miller πŸ“‚ Article πŸ“… 1987 πŸ› Elsevier Science 🌐 English βš– 361 KB

We consider the equations governing the electrical and thermal behaviour of a semiconductor device in two dimensions. A non-standard Petrov-Galerkin method is used to obtain a discretisation of the equations for stationary problems. The resulting scheme is a generalization to the two-dimensional cas

A modified quasi-creep model for assessm
✍ Zhi Y. Wang; Chee Y. Yue; Yee C. Lam; Sunanda Roy; Rajeeb K. Jena πŸ“‚ Article πŸ“… 2011 πŸ› John Wiley and Sons 🌐 English βš– 376 KB πŸ‘ 1 views

## Abstract The effects of thermomechanical properties of dissimilar polymer plates on thermal bonding were investigated and the resultant deformation of cover Topas COC plate was modeled using a simplified quasi‐creep model. The appropriate conditions for thermal bonding for minimal deformation of