A 3D thermal model for electrostatic discharge thermal runaway in semiconductor devices
β Scribed by H.H. Choi; T.A. DeMassa
- Publisher
- Elsevier Science
- Year
- 1995
- Tongue
- English
- Weight
- 279 KB
- Volume
- 38
- Category
- Article
- ISSN
- 0038-1101
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π SIMILAR VOLUMES
We consider the equations governing the electrical and thermal behaviour of a semiconductor device in two dimensions. A non-standard Petrov-Galerkin method is used to obtain a discretisation of the equations for stationary problems. The resulting scheme is a generalization to the two-dimensional cas
## Abstract The effects of thermomechanical properties of dissimilar polymer plates on thermal bonding were investigated and the resultant deformation of cover Topas COC plate was modeled using a simplified quasiβcreep model. The appropriate conditions for thermal bonding for minimal deformation of