6thInternational Symposium on ADVANCED POLYMERS VIA MACROMOLECULAR ENGINEERING (APME-6)

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✍ Mao, Hongxia; Zhang, Guang; Wu, Jie; Dong, Yanbin; Ma, Jing; Zhang, Yudong; Xian 📂 Article 📅 2012 🏛 SPIE ⚖ 497 KB

[Computer Aided Chemical Engineering] 10

[Computer Aided Chemical Engineering] 10th International Symposium on Process Systems Engineering: Part A Volume 27 || Computer Simulation of Hydrolytic Polymerization of SLS Nylon 6 to Correlate Polymer Characteristics and Operational Parameters

✍ Costa, Maria Carolina B. 📂 Article 📅 2009 🏛 Elsevier 🌐 English ⚖ 231 KB

This book contains the proceedings of the 10e of a series of international symposia on process systems engineering (PSE) initiated in 1982. The special focus of PSE09 is how PSE methods can support sustainable resource systems and emerging technologies in the areas of green engineering. \* C

SPIE Proceedings [SPIE 6th International

SPIE Proceedings [SPIE 6th International Symposium on Advanced Optical Manufacturing and Testing Technologies (AOMATT 2012) - Xiamen, China (Thursday 26 April 2012)] 6th International Symposium on Advanced Optical Manufacturing and Testing Technologies: Design, Manufacturing, and Testing of Smart Structures, Micro- and Nano-Optical Devices, and Systems - Diffractive devices fabricated on azobenezene polymer by polarization laser direct-writing

✍ Hao, Peng; Duan, Shiyuan; Cao, Zhaolou; Wu, Shuo; Wang, Keyi; Yan, Peizheng; Ye, 📂 Article 📅 2012 🏛 SPIE ⚖ 815 KB

[IEEE 2012 IEEE 12th International Confe

[IEEE 2012 IEEE 12th International Conference on Advanced Learning Technologies (ICALT) - Rome, Italy (2012.07.4-2012.07.6)] 2012 IEEE 12th International Conference on Advanced Learning Technologies - Personalized Mobile Learning via an Adaptive Engine

✍ Tortorella, Richard A.W.; Graf, Sabine 📂 Article 📅 2012 🏛 IEEE ⚖ 127 KB

[IMAPS - Int. Microelectron. & Packaging

[IMAPS - Int. Microelectron. & Packaging Soc International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces - Braselton, GA, USA (6-8 March 2000)] Proceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (Cat. No.00TH8507) - Thru-silicon vias for 3D WLP

✍ Savastionk, S.; Siniaguine, O.; Korczynski, E. 📂 Article 📅 2000 🏛 IMAPS - Int. Microelectron. & Packaging Soc ⚖ 183 KB

[IMAPS - Int. Microelectron. & Packaging

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✍ Nishiwaki, T.; Mikado, Y.; Kuroiwa, N. 📂 Article 📅 2000 🏛 IMAPS - Int. Microelectron. & Packaging Soc ⚖ 282 KB