✦ LIBER ✦
4965660 Integrated circuit package having heat sink bonded with resinous adhesive
✍ Scribed by Satoru Ogihara; Hironori Kodama; Nobuyuk Ushifusa; Kanji Otsuka
- Publisher
- Elsevier Science
- Year
- 1991
- Tongue
- English
- Weight
- 79 KB
- Volume
- 31
- Category
- Article
- ISSN
- 0026-2714
No coin nor oath required. For personal study only.