✦ LIBER ✦

4547833 High density electronics packaging system for hostile environment

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

Materials for high-density electronic pa

📂 Article 📅 1991 🏛 Elsevier Science ⚖ 470 KB

Micro cooling systems for high density p

✍ Bernd Gromoll 📂 Article 📅 1998 🏛 Elsevier Science 🌐 English ⚖ 785 KB

An aqueous developable photoimageable si

✍ G.G. Umarji; S.A. Ketkar; G.J. Phatak; V.D. Giramkar; U.P. Mulik; D.P. Amalnerka 📂 Article 📅 2005 🏛 Elsevier Science 🌐 English ⚖ 697 KB

ESM processor system for high pulse dens

✍ Rogers, J.A.V. 📂 Article 📅 1985 🏛 The Institution of Electrical Engineers ⚖ 692 KB

Prototype packages in aluminum nitride f

✍ Lodge, K.J.; Sparrow, J.A.; Perry, E.D.; Logan, E.A.; Goosey, M.T.; Pedder, D.J. 📂 Article 📅 1990 🏛 IEEE 🌐 English ⚖ 906 KB

The application of high density electron

✍ Lynn E. Lowry; Jon S. Prokop; Peter Sandborn; Kristan Evans 📂 Article 📅 1995 🏛 Elsevier Science 🌐 English ⚖ 602 KB