✦ LIBER ✦
3D Micro-Crack Propagation Simulation at Enamel/Adhesive Interface Using FE Submodeling and Element Death Techniques
✍ Scribed by Heng-Liang Liu; Chun-Li Lin; Ming-Tsung Sun; Yen-Hsiang Chang
- Book ID
- 106334149
- Publisher
- Springer
- Year
- 2010
- Tongue
- English
- Weight
- 677 KB
- Volume
- 38
- Category
- Article
- ISSN
- 0090-6964
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