3.125-Gb/s modulation up to 70/spl deg/C using 1.3-/spl mu/m VCSELs fabricated with localized wafer fusion for 10GBASE LX4 applications

✍ Scribed by Boucart, J.; Suruceanu, G.; Royo, P.; Iakovlev, V.I.; Syrbu, A.; Caliman, A.; Mereuta, A.; Mircea, A.; Berseth, C.-A.; Rudra, A.; Kapon, E.

• Book ID: 119802651
• Publisher: IEEE
• Year: 2006
• Tongue: English
• Weight: 406 KB
• Volume: 18
• Category: Article
• ISSN: 1041-1135
• DOI: 10.1109/lpt.2005.863980