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3-D Numerical Simulation and Validation of Underfill Flow of Flip-Chips

✍ Scribed by Sung-Won Moon; Zhihua Li; Gokhale, S.; Jinlin Wang

Book ID
119815839
Publisher
Institute of Electrical and Electronics Engineers
Year
2011
Tongue
English
Weight
537 KB
Volume
1
Category
Article
ISSN
2156-3950

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