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3-D Coupled Thermo-Electromagnetic Modelling of Superconducting Coils

✍ Scribed by Cavaliere, V.; Masullo, G.; Formisano, A.

Book ID
114652767
Publisher
IEEE
Year
2009
Tongue
English
Weight
354 KB
Volume
45
Category
Article
ISSN
0018-9464

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## Abstract This article presents a full‐wave electromagnetic approach for analyzing the electrical performance of massively coupled through silicon vias (TSV). The TSVs are modeled with SiO~2~ insulation coating and are placed in the sandwiched SiO~2~‐Si‐SiO~2~ substrate. The planar guided wave is