2474. X-ray diffraction study of interdiffusion in bimetallic Ag/Cu thin films
- Publisher
- Elsevier Science
- Year
- 1977
- Tongue
- English
- Weight
- 260 KB
- Volume
- 27
- Category
- Article
- ISSN
- 0042-207X
No coin nor oath required. For personal study only.
β¦ Synopsis
consists of a central initiation site caused during the high-voltage collapse and a surrounding dendritic etching caused after the voltage collapse. Energy dispersive analysis of the central region shows that when contaminants are observed they are dielectric. Dielectric particles above 10 , ~L diameter which are deliberately placed on the cathode cause breakdown during ion bombardment. These particles attain fields comparable to their dielectric strength (MV/cm) in ~s times from charging during ion bombardment (0.3 A/era'). The discharging of these particles is believed to initiate interclectrode breakdown.
π SIMILAR VOLUMES
The deformation behaviour of 150 nm thick W/Cu nanocomposite deposited on polyimide substrates has been analysed under equi-biaxial tensile testing coupled to X-ray diffraction technique. The experiments were carried out using a biaxial device that has been developed for the DiffAbs beamline of SOLE