✦ LIBER ✦
19th Hot Chips Conference Meets on 19–21 August at Stanford University, Three days of Leading-Edge, Real-World Designs for High-performance Chips and Technologies
✍ Scribed by Draper, Don; Sell, John; Baum, Allen
- Book ID
- 114586661
- Publisher
- Institute of Electrical and Electronics Engineers
- Year
- 2007
- Weight
- 190 KB
- Volume
- 12
- Category
- Article
- ISSN
- 1098-4232
No coin nor oath required. For personal study only.