✦ LIBER ✦
1254. Thermocompression bonding to thin film microcircuits: L. S. Phillips, Brit. Comm. & Electron, 10, June 1963, 456–458
- Publisher
- Elsevier Science
- Year
- 1963
- Tongue
- English
- Weight
- 85 KB
- Volume
- 13
- Category
- Article
- ISSN
- 0042-207X
No coin nor oath required. For personal study only.