11th International Heat Transfer Conference : 23–28 August 1998, Kyongju, Korea

✍ Scribed by J.S. Lee

• Publisher: Elsevier Science
• Year: 1997
• Tongue: English
• Weight: 55 KB
• Volume: 40
• Category: Article
• ISSN: 0017-9310
• DOI: 10.1016/s0017-9310(97)90001-6

✦ Synopsis

SCOPE AND TOPICS OF THE SEMINAR

This EUROTHERM Seminar will be a forum for exploring progress in the analysis of macro and microscale heat transfer, cooling techniques and thermally induced failures in electronic systems. The field will cover, among others, microelectronics, power electronics and opto-electronics. Analysis will focus on the system and the component level as well as on integrated circuits, multichip modules, high density packages, sensors and card etc. The contributed papers will deal with thermal management in optimal design, thermal characterization and measurement techniques, analytical and computational thermal modelling, single and multiphase convective cooling, applications of new materials in thermal management, thermal reliability and thermal problems in material and package processing.